Circuit board module for display device, method for manufacturing the same, and display device

ABSTRACT

Disclosed is an circuit board module for a display device having a rigid-flex circuit board structure which is capable of improving spatial efficiency of a mother board, and simplifying a structure of the mother board, a method for manufacturing the same, and a display device, wherein a rigid-flex printed circuit board, a rigid printed circuit board, and a flexible printed circuit cable are respectively manufactured on the different mother boards, separately, and then combined with one another, whereby it is possible to realize the more-improved spatial efficiency of the mother board in comparison to a case of manufacturing the rigid-flex printed circuit board, the rigid printed circuit board, and the flexible printed circuit cable on one mother board.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefit of the Korean Patent Application No.10-2016-0179764 filed on Dec. 27, 2016, which is hereby incorporated byreference as if fully set forth herein.

BACKGROUND Field of the Disclosure

The present disclosure relates to a display device, and moreparticularly, to a circuit board module for a display device, a displaydevice including the same, and a method for manufacturing the same.

Description of the Background

With the advancement of information society, a display field fordisplaying video information has been developed rapidly, so that variousdisplay devices have been researched actively. Herein, varioustechnologies for the display devices relate to thin profile, lightweight, and reduced power consumption. As the related technologies aredeveloped, an application field of the display devices becomes wider.The display device may be used as a user interface in electronic devicesor mobile devices.

A circuit board module for a display device is a set of boards on whichcircuits for driving a display device are mounted as a type ofintegrated circuit (IC) or a chip. The circuit board module for adisplay device includes a control printed circuit board (C-PCB) forcontrolling driving timing of the display device and supplyinginformation on an image to be displayed on the display device bysupplying digital video data and timing signals, and a source printedcircuit board (S-PCB) for supplying an analog data voltage to thedisplay device.

The control printed circuit board (C-PCB) and the source printed circuitboard (S-PCB) may be connected with a flexible printed circuit cable(Flex) having flexibility. The control printed circuit board (C-PCB) andthe source printed circuit board (S-PCB) are rigid boards. The circuitboard module for a display device where the control printed circuitboard (C-PCB) and the source printed circuit board (S-PCB) are connectedby the use of flexible printed circuit cable (Flex) is defined as arigid-flex circuit board.

According to the related art, if the circuit board module for a displaydevice is formed of the rigid-flex circuit board, the circuit boardmodule for a display device is formed as one body with the controlprinted circuit board (C-PCB), the source printed circuit board (S-PCB),and the flexible printed circuit cable on one mother board. That is, thecontrol printed circuit board (C-PCB) and the source printed circuitboard (S-PCB) are formed on rigid portions of the circuit board modulefor a display device and are provided in such a way that the controlprinted circuit board (C-PCB) and the source printed circuit board(S-PCB) are connected with remaining portions of the circuit boardmodule for a display device by the use of flexible printed circuitcable. In this case, a shape of the circuit board module for a displaydevice causes a large empty space on the mother board, which lowersspatial efficiency of the mother board. Also, the flexible printedcircuit cable has to be provided on the mother board, which causes acomplicated structure of the mother board.

SUMMARY

Accordingly, the present disclosure is directed to a circuit boardmodule for a display device that substantially obviates one or moreproblems due to limitations and disadvantages of the related art, adisplay device including the same, and a method for manufacturing thesame.

An aspect of the present disclosure is directed to provide a circuitboard module for a display device having a rigid-flex circuit boardstructure which is capable of improving spatial efficiency of a motherboard, and simplifying a structure of the mother board, a display deviceincluding the same, and a method for manufacturing the same.

Additional advantages and features of aspects of the disclosure will beset forth in part in the description which follows and in part willbecome apparent to those having ordinary skill in the art uponexamination of the following or may be learned from practice of aspectsof the disclosure. Other advantages of aspects of the disclosure may berealized and attained by the structure particularly pointed out in thewritten description and claims hereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof aspects of the disclosure, as embodied and broadly described herein,there is provided a circuit board module for a display device that mayinclude a rigid-flex printed circuit board having a rigid portion and aplurality of flexible portions, a plurality of flexible printed circuitcables attached to the rigid portion of the rigid-flex printed circuitboard, and a rigid printed circuit board to which the plurality offlexible printed circuit cables are attached.

In another aspect of the present disclosure, there is provided a displaydevice that may include a display panel having a panel pad portion, anda circuit board module for a display device connected with the panel padportion.

In yet another aspect of the present disclosure, there is provided amethod for manufacturing a circuit board module for a display devicethat may include manufacturing a rigid-flex printed circuit board havinga rigid portion and a plurality of flexible portions by the use of firstmother board, manufacturing a rigid printed circuit board by the use ofsecond mother board, manufacturing a plurality of flexible printedcircuit cables by the use of third mother board, and attaching theplurality of flexible printed circuit cables to the rigid portion of therigid-flex printed circuit board and the rigid printed circuit board.

It is to be understood that both the foregoing general description andthe following detailed description of aspects of the present disclosureare exemplary and explanatory and are intended to provide furtherexplanation of the disclosure as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of aspects of the disclosure and are incorporated in andconstitute a part of this application, illustrate aspect(s) of thedisclosure and together with the description serve to explain theprinciple of aspects of the disclosure.

In the drawings:

FIG. 1 is a plan view illustrating a circuit board module for a displaydevice according to an aspect of the present disclosure;

FIG. 2 is a plan view illustrating a rigid-flex printed circuit boardaccording to an aspect of the present disclosure;

FIG. 3 is a plan view illustrating a rigid printed circuit boardaccording to an aspect of the present disclosure;

FIG. 4 is a plan view illustrating a flexible printed circuit cableaccording to an aspect of the present disclosure;

FIG. 5 is a perspective view illustrating a rigid-flex printed circuitboard according to an aspect of the present disclosure;

FIG. 6 is a plan view illustrating a display device according to anaspect of the present disclosure;

FIG. 7 is a plan view illustrating a display device according to anotheraspect of the present disclosure;

FIG. 8 is a plan view illustrating a display device according to yetanother aspect of the present disclosure;

FIG. 9 is a cross-sectional view taken along line I-I′ of FIG. 8;

FIG. 10 is a plan view illustrating a first mother board in a method formanufacturing a circuit board module for a display device according toan aspect of the present disclosure;

FIG. 11 is a plan view illustrating a second mother board in a methodfor manufacturing a circuit board module for a display device accordingto an aspect of the present disclosure;

FIG. 12 is a plan view illustrating a third mother board in a method formanufacturing a circuit board module for a display device according toan aspect of the present disclosure; and

FIG. 13 is a lateral side view illustrating a process of attaching aflexible printed circuit cable to a rigid portion of a rigid-flexprinted circuit board and a rigid printed circuit board in a method formanufacturing a circuit board module for a display device according toan aspect of the present disclosure.

DETAILED DESCRIPTION

Reference will now be made in detail to the exemplary aspects of thepresent disclosure, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.Advantages and features of the present disclosure, and implementationmethods thereof will be clarified through following aspects describedwith reference to the accompanying drawings. The present disclosure may,however, be embodied in different forms and should not be construed aslimited to the aspects set forth herein. Rather, these aspects areprovided so that this disclosure will be thorough and complete, and willfully convey the scope of the present disclosure to those skilled in theart. Further, the present disclosure is only defined by scopes ofclaims. A shape, a size, a ratio, an angle, and a number disclosed inthe drawings for describing aspects of the present disclosure are merelyan example, and thus, the present disclosure is not limited to theillustrated details. Like reference numerals refer to like elementsthroughout. In the following description, when the detailed descriptionof the relevant known function or configuration is determined tounnecessarily obscure the important point of the present disclosure, thedetailed description will be omitted.

In a case where ‘comprise’, ‘have’, and ‘include’ described in thepresent specification are used, another part may be added unless ‘only˜’is used. The terms of a singular form may include plural forms unlessreferred to the contrary.

In construing an element, the element is construed as including an errorregion although there is no explicit description.

In describing a position relationship, for example, when the positionalorder is described as ‘on˜’, ‘above˜’, ‘below˜’, and ‘next˜’, a casewhich is not contact may be included unless ‘just’ or ‘direct’ is used.

In describing a time relationship, for example, when the temporal orderis described as ‘after˜’, ‘subsequent˜’, ‘next˜’, and ‘before˜’, a casewhich is not continuous may be included unless ‘just’ or ‘direct’ isused.

It will be understood that, although the terms “first”, “second”, etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the present disclosure.

Also, “X-axis direction”, “Y-axis direction”, and “Z-axis direction” arenot limited to a perpendicular geometric configuration. That is, “X-axisdirection”, “Y-axis direction”, and “Z-axis direction may include anapplicable wide range of a functional configuration.

Also, it should be understood that the term “at least one” includes allcombinations related with any one item. For example, “at least one amonga first element, a second element and a third element” may include allcombinations of two or more elements selected from the first, second andthird elements as well as each element of the first, second and thirdelements. Also, if it is mentioned that a first element is positioned“on or above” a second element, it should be understood that the firstand second elements may be brought into contact with each other, or athird element may be interposed between the first and second elements.

Features of various aspects of the present disclosure may be partiallyor overall coupled to or combined with each other, and may be variouslyinter-operated with each other and driven technically as those skilledin the art can sufficiently understand. The aspects of the presentdisclosure may be carried out independently from each other, or may becarried out together in co-dependent relationship.

Hereinafter, a circuit board module for a display device according to anaspect of the present disclosure, a display device including the same,and a method for manufacturing the circuit board module for a displaydevice will be described in detail with reference to the accompanyingdrawings.

FIG. 1 is a plan view illustrating a circuit board module for a displaydevice according to an aspect of the present disclosure. The circuitboard module for a display device according to an aspect of the presentdisclosure may include a rigid-flex printed circuit board 100, a rigidprinted circuit board 200, and a plurality of flexible printed circuitcables 300.

The rigid-flex printed circuit board 100 may include a rigid portion110, and a plurality of flexible portions 120. The rigid-flex printedcircuit board 100 is formed in a horizontally-long shape, and the rigidportion 110 is formed in a horizontally-long rectangular shape. Theplurality of flexible portions 120 protrudes from a long side of therigid portion 110. FIG. 1 shows the four flexible portions 120, but notlimited to this structure. The number of flexible portions 120 may bemore than four, or less than four.

The rigid-flex printed circuit board 100 may be a source printed circuitboard (S-PCB) for supplying an analog data voltage to a display panel.The rigid-flex printed circuit board 100 may supply the data voltage tothe display panel by the use of flexible portions 120.

The rigid printed circuit board 200 is attached to one end of each ofthe plurality of flexible printed circuit cables 300, and the other endof each of the plurality of flexible printed circuit cables 300 isattached to a long side of the rigid-flex printed circuit board 100while being perpendicular to the long side of the rigid-flex printedcircuit board 100.

A timing controller 210 may be mounted on the rigid printed circuitboard 200. The rigid printed circuit board 200 may be a control printedcircuit board (C-PCB) for supplying information on an image to bedisplayed on a display device by supplying digital video data and timingsignals, and controlling driving timing of the display device.

The plurality of flexible printed circuit cables 300 may be attached tothe rigid portion 110 of the rigid-flex printed circuit board 100, sothat one end in each of the plurality of flexible printed circuit cables300 may be attached to a long side of the rigid portion 110 while beingperpendicular to the long side of the rigid portion 110. FIG. 1 showsthe two of flexible printed circuit cables 300, but not limited to thisstructure. The number of flexible printed circuit cables 300 may be morethan two, or less than two.

The plurality of flexible printed circuit cables 300 electricallyconnect the rigid-flex printed circuit board 100 and the rigid printedcircuit board 200 with each other. The plurality of flexible printedcircuit cables 300 may be crooked, bent, or curved in various shapes.The plurality of flexible printed circuit cables 300 connect therigid-flex printed circuit board 100 and the rigid printed circuit board200 with each other, and enable various arrangements of the rigid-flexprinted circuit board 100 and the rigid printed circuit board 200.Accordingly, a volume of the circuit board module for a display devicecan be reduced according to an aspect of the present disclosure, and thecircuit board module for a display device with the reduced volume may beapplied to various shapes of the display device.

FIG. 2 is a plan view illustrating the rigid-flex printed circuit board100 according to an aspect of the present disclosure.

The rigid-flex printed circuit board 100 according to an aspect of thepresent disclosure may include a plurality of first bonding pads (BP1)formed in the rigid portion 110, and a plurality of second bonding pads(BP2) formed in the plurality of flexible portions 120.

The first bonding pad (BP1) is disposed along the long side of the rigidportion 110. The first bonding pad (BP1) may be provided on a frontsurface or rear surface of the rigid portion 110. The first bonding pad(BP1) is electrically connected with the flexible printed circuit cable300. Instead of forming the flexible printed circuit cable 300 and therigid portion 110 as one body, the flexible printed circuit cable 300may be formed separately, and then connected with the rigid portion 110by an additional bonding process through the use of first bonding pad(BP1). This bonding process is referred to as a hot-bar bonding. Thefirst bonding pad (BP1) is formed of metal or alloy with high electricalconductivity.

The second bonding pad (BP2) is formed at one side in each of theplurality of flexible portions 120. Specifically, the second bonding pad(BP2) may be formed at the side of the flexible portion 120, which isopposite to the side adjacent to the rigid portion 110. The secondbonding pad (BP2) is electrically connected with the display panel 400.The plurality of flexible portions 120, which extend from the rigidportion 110, are manufactured at the same time, and the second bondingpad (BP2) is attached to the display panel 400 by an additional process.The second bonding pad (BP2) is formed of metal or alloy with highelectrical conductivity.

The rigid-flex printed circuit board 100 may be electrically connectedwith the flexible printed circuit cable 300 and the display panel 400 bythe use of first bonding pad (BP1) and second bonding pad (BP2).Accordingly, the rigid-flex printed circuit board 100 may supply anelectrical signal from the flexible printed circuit cable 300 to thedisplay panel 400.

FIG. 3 is a plan view illustrating the rigid printed circuit board 200according to an aspect of the present disclosure.

The rigid printed circuit board 200 according to an aspect of thepresent disclosure may include a third bonding pad (BP3).

The third bonding pad (BP3) is disposed adjacent to the long side of therigid printed circuit board 200. The third bonding pad (BP3) is attachedto each of the plurality of flexible printed circuit cables 300. Whenthe first bonding pad (BP1) is attached to one side of the flexibleprinted circuit cable 300, the third bonding pad (BP3) is attached tothe opposite side of the flexible printed circuit cable 300, that is,the other side of the flexible printed circuit cable 300. Instead offorming the flexible printed circuit cable 300 and the rigid printedcircuit board 200 as one body, the flexible printed circuit cable 300may be formed separately, and then connected with the rigid printedcircuit board 200 by an additional bonding process through the use ofthird bonding pad (BP3). This bonding process is referred to as ahot-bar bonding. The third bonding pad (BP3) is formed of metal or alloywith high electrical conductivity.

The rigid printed circuit board 200 may be electrically connected withthe flexible printed circuit cable 300 by the use of third bonding pad(BP3). Accordingly, the rigid printed circuit board 200 may supply anelectrical signal to the flexible printed circuit cable 300.

FIG. 4 is a plan view illustrating the flexible printed circuit cable300 according to an aspect of the present disclosure.

The flexible printed circuit cable 300 may include a fourth bonding pad(BP4) attached to the first bonding pad (BP1), and a fifth bonding pad(BP5) attached to the third bonding pad (BP3).

The fourth bonding pad (BP4) is formed at one side of the flexibleprinted circuit cable 300, and is attached to the first bonding pad(BP1). The fourth bonding pad (BP4) is connected with the rigid-flexprinted circuit board 100. The fourth bonding pad (BP4) is formed ofmetal or alloy with high electrical conductivity.

The fifth bonding pad (BP5) is formed at the other side of the flexibleprinted circuit cable 300, and is attached to the third bonding pad(BP3). The fifth bonding pad (BP5) is connected with the rigid printedcircuit board 200. The fifth bonding pad (BP5) is formed of metal oralloy with high electrical conductivity.

The flexible printed circuit cable 300 electrically connects therigid-flex printed circuit board 100 and the rigid printed circuit board200 with each other by the use of fourth bonding pad (BP4) and fifthbonding pad (BP5). Accordingly, the flexible printed circuit cable 300may supply electrical signals, which are generated in the rigid printedcircuit board 200, to the rigid-flex printed circuit board 100.

Also, the flexible printed circuit cable 300 electrically connects therigid-flex printed circuit board 100 and the rigid printed circuit board200 with each other by the use of fourth bonding pad (BP4) and fifthbonding pad (BP5). Thus, instead of forming the flexible printed circuitcable 300 as one body with the rigid-flex printed circuit board 100 andthe rigid printed circuit board 200, the flexible printed circuit cable300 may be formed separately. Accordingly, it is possible to provide theflexible printed circuit cable 300 with a different material from thoseof the rigid-flex printed circuit board 100 and the rigid printedcircuit board 200, to thereby improve the yield.

FIG. 5 is a perspective view illustrating the rigid-flex printed circuitboard 100 according to an aspect of the present disclosure.

The rigid-flex printed circuit board 100 according to an aspect of thepresent disclosure may include a flexible base film having a first areaoverlapping the rigid portion 110, and a plurality of second areas whichprotrudes from the first area while respectively overlapping theplurality of flexible portions 120.

The flexible base film is provided in both the rigid portion 110 and theflexible portion 120. As a curable PCB plate or a cover shield forstably maintaining a shape is deposited on the first area of theflexible base film corresponding to the rigid portion 110, the flexiblebase film in the rigid portion 110 becomes a rigid area. Meanwhile, asonly the flexible base film is provided in the flexible portion 120, ora flexible circuit or a flexible chip is deposited on the second area ofthe flexible base film corresponding to the flexible portion 120, theflexible base film in the flexible portion 120 becomes a flexible area.The flexible base film may include a flexible material, for example,polyimide. In addition, the flexible base film may be formed of amaterial with flexibility.

In case of the flexible base film, the rigid portion 110 and theflexible portion 120 are not separated from each other, but areconnected with each other. The rigid portion 110 and the flexibleportion 120 may be continuously provided by the use of flexible basefilm, and formed as one body without using an additional connectionmember. Accordingly, when the flexible base film in the flexible portion120 is connected with the display panel, the flexible portion 120 may becurved or bent due to a step difference (height difference) between theflexible portion 120 and the display panel. Even in this case, it ispossible to reduce possibility of a separation between the rigid portion110 and the flexible portion 120, and damages on the rigid portion 110and the flexible portion 120.

The rigid-flex printed circuit board 100 according to an aspect of thepresent disclosure includes a driving wiring portion 130 with a wiringportion formed on the flexible base film, and the driving wiring portion130 having at least one layer is connected with each of the plurality offirst bonding pads (BP1) and the plurality of second bonding pads (BP2).

The driving wiring portion 130 includes a driving integrated circuitchip, and the wiring portion which extends from the driving integratedcircuit chip, and is connected with each of the plurality of firstbonding pads (BP1) and the plurality of second bonding pads (BP2). Thewiring portion includes wiring lines for electrically connecting thedriving integrated circuit chip with the plurality of first bonding pads(BP1) and the plurality of second bonding pads (BP2). The wiring linemay include any one of conductive metal materials such as copper (Cu),aurums (Au), argentums (Ag), aluminum (Al), nickel (Ni), and tin (Sn),or their alloys.

Each of the first bonding pad (BP1) and the second bonding pad (BP2)supplies a signal from the wiring line to the driving integrated circuitchip, and receive a signal from the driving integrated circuit chip.Accordingly, the first bonding pad (BP1) and the second bonding pad(BP2) are electrically connected with each other, so that a signal canbe exchanged between the first bonding pad (BP1) and the second bondingpad (BP2).

The rigid-flex printed circuit board 100 according to an aspect of thepresent disclosure may further include a protection layer for coveringthe driving wiring portion 130, and the protection layer may be formedon some portions of the first area, and some portions of the secondarea. The protection layer may be an encapsulation film, an insulatingfilm, or an encapsulation film having the insulating properties. Forexample, the protection layer may be photo solder resist (PSR).

The protection layer according to an aspect of the present disclosurecovers the remaining of the driving wiring portion 130 except for theplurality of first bonding pads (BP1) and the plurality of secondbonding pads (BP2). In order to electrically connect the plurality offirst bonding pads (BP1) and the plurality of second bonding pads (BP2)with the rigid printed circuit board 200 and the flexible printedcircuit cable 300, the protection layer is not formed in the pluralityof first bonding pads (BP1) and the plurality of second bonding pads(BP2).

If the driving wiring portion 130 is covered by the protection layer, itis possible to prevent a disconnection of the wiring line connected withthe plurality of first bonding pads (BP1) and the plurality of secondbonding pads (BP2). Also, if the driving wiring portion 130 is coveredby the protection layer, it is possible to prevent the driving wiringportion 130 from being damaged by an external shock and to preventforeign matters such as oxygen or moisture from being permeated into thedriving wiring portion 130.

FIG. 6 is a plane view illustrating a display device according to anaspect of the present disclosure. The display device according to anaspect of the present disclosure may include a display panel 400, adisplay area 410, a gate driver 420, and a driving integrated circuit430.

The display panel 400 according to an aspect of the present disclosuremay include a plurality of gate and data lines crossing each other.

The plurality of gate lines is extending in a first horizontal axisdirection of the display panel 400, and is provided at fixed intervalsalong a second horizontal axis direction which is perpendicular to thefirst horizontal axis direction.

The plurality of data lines is perpendicular to the plurality of gatelines. The plurality of data lines is extending in the second horizontalaxis direction, and is provided at fixed intervals along the firsthorizontal axis direction.

Then, pixels are provided at respective crossing area of the gate anddata lines. Each of the pixels is connected with the gate and datalines. Each pixel includes a thin film transistor and a storagecapacitor. The thin film transistor is turned-on by a gate signal of thegate line, and the turned-on thin film transistor supplies a datavoltage of the data line to the pixel.

The display panel 400 may include the display area 410 and a non-displayarea. In the display area 410, there are the gate and data linescrossing each other, and pixel areas are defined by the crossing areasof the gate and data lines. An image may be displayed on the pixel areasof the display area 410.

The non-display area is provided in the periphery of the display area410. In more detail, the non-display area may be the remaining areaexcept for the display area 410 of the display panel 400. Thenon-display area may be the lower, upper, left, and right borders of thedisplay panel 400.

The display panel 400 is provided with a panel pad portion and a chipmounting portion. The panel pad portion is formed in the non-displayarea of the display panel 400. FIG. 6 shows that the panel pad portionis formed in the non-display area of the upper border of the displaypanel 400.

The gate driver 420 generates the gate signal in accordance with a gatetiming control signal supplied from the timing controller 210, andsupplies the generated gate signal to the gate line. The gate driver 420according to an aspect of the present disclosure may be formed as agate-in-panel (GIP) circuit in the non-display area of the display panel400.

The GIP circuit together with the thin film transistor of the pixel maybe provided inside the non-display area of the display panel 400. Forexample, the gate driver 420 of the GIP circuit may be prepared at oneside, at the other side, or at both sides of the display area 410, butnot limited to this structure. The gate driver 420 of the GIP circuitmay be prepared in any area of the non-display area enabling the supplyof the gate signal to the gate line.

Each of the plurality of driving integrated circuits 430 may be mountedon the chip mounting portion inside the display panel 400. The chipmounting portion is formed between the panel pad portion and the displayarea 410. Each of the plurality of driving integrated circuits 430receives digital video data and data timing control signal from thetiming controller 210, converts the digital video data into an analogdata voltage in accordance with the data timing control signal, andsupplies the analog data voltage to the data lines. Each of theplurality of driving integrated circuits 430 may be mounted on the chipmounting portion by chip on glass (COG) or chip on plastic (COP) method.

Each of the plurality of flexible printed circuit cables 300 is attachedto the panel pad portion prepared in the display panel 400. In thiscase, each of the plurality of flexible printed circuit cables 300 isattached onto the panel pad portion by the use of anisotropic conductingfilm (ACF). Each of the flexible printed circuit cables 300 supplies thedigital video data and data timing control signal from the timingcontroller 210 to the driving integrated circuit 430 through the panelpad portion. Also, at least one among the plurality of flexible printedcircuit cables 300 supplies the gate timing control signal from thetiming controller 210 to the gate driver 420. The plurality of flexibleprinted circuit cables 300 may be curved smoothly. In order to realize asmall size of the display device, the flexible printed circuit cable 300may be bent upward to overlap the rigid printed circuit board 200.

The timing controller 210, which is mounted on the rigid printed circuitboard 200, receives digital video data and timing synchronizationsignals from an external system board. In this case, the timingsynchronization signals may include a vertical synchronization signal(vertical sync signal) for defining one frame period, a horizontalsynchronization signal (horizontal sync signal) for defining onehorizontal period, a data enable signal for indicating whether data isvalid, and a dot clock corresponding to a clock signal with apredetermined cycle.

The timing controller 210 generates the gate timing control signal forcontrolling operation timing of the gate driver 420, and the data timingcontrol signal for controlling the driving integrated circuits 430 onthe basis of timing synchronization signals. The timing controller 210supplies the gate timing control signal to the gate driver 420, andsupplies the data timing control signal to the plurality of drivingintegrated circuits 430.

FIG. 7 is a plan view illustrating a display device according to anotheraspect of the present disclosure. Except for a plurality of drivingintegrated circuits 430, the display device according to another aspectof the present disclosure shown in FIG. 7 is identical to the displaydevice according to an aspect of the present disclosure shown in FIG. 6,and a detailed description for the same parts will be omitted.

In case of the display device according to another aspect of the presentdisclosure, each of the plurality of driving integrated circuits 430 ismounted on each of a plurality of flexible portions 120. Each of theplurality of driving integrated circuits 430 receives digital video dataand a data timing control signal from a timing controller 210, convertsthe digital video data into an analog data voltage in accordance withthe data timing control signal, and supplies the analog data voltage todata lines. Each of the plurality of driving integrated circuits 430 maybe mounted on the flexible portion 120 by chip on film (COF) method.

FIG. 8 is a plan view illustrating a display device according to yetanother aspect of the present disclosure. Except for a flexible printedcircuit cable 300, the display device according to yet another aspect ofthe present disclosure shown in FIG. 8 is identical to the displaydevice according to another aspect of the present disclosure shown inFIG. 7, and a detailed description for the same parts will be omitted.

In the display device according to yet another aspect of the presentdisclosure, the flexible printed circuit cable 300 is not curved, and isconnected between a rigid printed circuit board 200 and a rigid portion110 of a rigid-flex printed circuit board. In this case, a connectionportion between the flexible printed circuit cable 300 and the rigidportion 110 of the rigid-flex printed circuit board is arranged in anopposite direction to a connection portion between the flexible printedcircuit cable 300 and the rigid printed circuit board 200. Also, theconnection portion between the flexible printed circuit cable 300 andthe rigid portion 110 of the rigid-flex printed circuit board isarranged in an opposite direction to a protruding direction of aflexible portion 120.

FIG. 9 is a cross sectional view taken along line I-I′ of FIG. 8.Hereinafter, a structure along I-I′ will be described sequentially.

A third bonding pad (BP3) is formed at one corner of the rigid printedcircuit board 200. The third bonding pad (BP3) is in contact with afifth bonding pad (BP5) prepared at one corner of the flexible printedcircuit cable 300. Accordingly, the rigid printed circuit board 200 andthe flexible printed circuit cable 300 are electrically connected witheach other.

A first bonding pad (BP1) is formed at one corner of the rigid portion110 of the rigid-flex printed circuit board. The first bonding pad (BP1)is in contact with a fourth bonding pad (BP4) formed at the other cornerof the flexible printed circuit cable 300. Accordingly, the rigidportion 110 of the rigid-flex printed circuit board and the flexibleprinted circuit cable 300 are electrically connected with each other.

As shown in FIG. 9, a height of an upper surface in the rigid portion110 of the rigid-flex printed circuit board is the same as a height ofan upper surface in the rigid printed circuit board 200. In this case,the rigid portion 110 of the rigid-flex printed circuit board and therigid printed circuit board 200 are electrically connected with eachother by the flexible printed circuit cable 300 which is in a flatstate, but not limited to this structure. For example, a height of anupper surface in the rigid portion 110 of the rigid-flex printed circuitboard may be higher than a height of an upper surface in the rigidprinted circuit board 200. In this case, the rigid portion 110 of therigid-flex printed circuit board and the rigid printed circuit board 200may be electrically connected with each other by the flexible printedcircuit cable 300 which is in a bent state.

The flexible portion 120 of the rigid-flex printed circuit board extendsfrom any one layer of the center of the rigid portion 110. In detail,the flexible portion 120 extends from a flexible base film of the rigidportion 110. A driving integrated circuit 430 may be mounted on theflexible portion 120.

A second bonding pad (BP2) is formed at one corner of the flexibleportion 120 of the rigid-flex printed circuit board. The second bondingpad (BP2) is in contact with a panel pad portion (PP) formed at onecorner of a display panel 400. Accordingly, the flexible portion 120 ofthe rigid-flex printed circuit board and the display panel 400 areelectrically connected with each other.

A method for manufacturing the circuit board module for a display deviceaccording to an aspect of the present disclosure may includemanufacturing the rigid-flex printed circuit board 100 having the rigidportion 110 and the plurality of flexible portions 120 by the use offirst mother board (MB1), manufacturing the rigid printed circuit board200 by the use of second mother board (MB2), manufacturing the pluralityof flexible printed circuit cables 300 by the use of third mother board(MB3), and attaching the plurality of flexible printed circuit cables300 to the rigid printed circuit board 200 and the rigid portion 110 ofthe rigid-flex printed circuit board 100.

FIG. 10 is a plan view illustrating the first mother board (MB1)according to a method for manufacturing the circuit board module for adisplay device according to an aspect of the present disclosure.

The rigid-flex printed circuit board 100 having the rigid portion 110and the plurality of flexible portions 120 is manufactured on the firstmother board (MB1). The rigid-flex printed circuit board 100 includesthe rigid portion 110 and the plurality of flexible portions 120, andthe first bonding pad (BP1) is formed in the rigid portion 110. Theplurality of rigid-flex printed circuit boards 100 may be manufacturedat the same time on the first mother board (MB1). The rigid-flex printedcircuit board 100 has a rectangular shape with relatively-slightprotrusions. Thus, if manufacturing only the rigid-flex printed circuitboards 100 on the first mother board (MB1), it is possible to maximizespatial efficiency of the first mother board (MB1) when manufacturingthe rigid-flex printed circuit boards 100.

FIG. 11 is a plan view illustrating the second mother board (MB2)according to a method for manufacturing the circuit board module for adisplay device according to an aspect of the present disclosure.

The rigid printed circuit board 200 is manufactured on the second motherboard (MB2). The third bonding pad (BP3) may be formed in the rigidprinted circuit board 200, and the timing controller 210 may be mountedon the rigid printed circuit board 200. The plurality of rigid printedcircuit boards 200 may be manufactured at the same time on the secondmother board (MB2). The rigid printed circuit board 200 has arectangular shape. Thus, if manufacturing only the rigid printed circuitboards 200 on the second mother board (MB2), it is possible to maximizespatial efficiency of the second mother board (MB2) when manufacturingthe rigid printed circuit boards 200.

FIG. 12 is a plan view illustrating the third mother board (MB3)according to a method for manufacturing the circuit board module for adisplay device according to an aspect of the present disclosure.

The flexible printed circuit cable 300 is manufactured on the thirdmother board (MB3). The fourth bonding pad (BP4) is formed at one sideof the flexible printed circuit cable 300, and the fifth bonding pad(BP5) is formed at the other side of the flexible printed circuit cable300.

The plurality of flexible printed circuit cables 300 may be manufacturedat the same time on the third mother board (MB3). The flexible printedcircuit cable 300 has a rectangular shape. Thus, if manufacturing onlythe flexible printed circuit cables 300 on the third mother board (MB3),it is possible to maximize spatial efficiency of the third mother board(MB3) when manufacturing the flexible printed circuit cables 300.

In the method for manufacturing the circuit board module for a displaydevice according to one aspect of the present disclosure, the firstmother board (MB1) is the rigid mother board with the flexible base filmprovided therein, the second mother board (MB2) is the rigid motherboard, and the third mother board (MB3) is the flexible mother board.

The first mother board (MB1) is formed of the rigid mother boardprovided with the flexible base film therein so as to manufacture therigid-flex printed circuit board 100. The rigid portion 110 of therigid-flex printed circuit board 100 includes all layers provided in therigid mother board, and the flexible portion 120 include only theflexible base film by removing rigid layers from the rigid mother board.

The second mother board (MB2) is formed of the rigid mother board so asto manufacture the rigid printed circuit board 200. The third motherboard (MB3) is formed of the flexible mother board so as to manufacturethe flexible printed circuit cable 300.

If the kind of mother board is determined based on the kind of elementsto be manufactured on the mother board, it is possible to manufacturethe plurality of elements at the same time on the mother board.Especially, if the different kinds of elements are respectivelymanufactured on the first to third mother boards (MB1˜MB3) according toan aspect of the present disclosure, the kind of each of the first tothird mother boards (MB1˜MB3) is determined based on the kind ofelements to be manufactured on each mother board, which enables torealize a simplified manufacturing process.

FIG. 13 is a lateral side view illustrating a process of attaching theflexible printed circuit cable 300 to the rigid portion 110 of therigid-flex printed circuit board 100 (shown in FIG. 9) and the rigidprinted circuit board 200 in a method for manufacturing the circuitboard module for a display device according to an aspect of the presentdisclosure.

Each of the rigid-flex printed circuit board 100, the rigid printedcircuit board 200, and the flexible printed circuit cable 300constituting the circuit board module for a display device ismanufactured on each mother board.

The first bonding pad (BP1) is prepared at one corner of the rigidportion 110 of the rigid-flex printed circuit board 100, and the thirdbonding pad (BP3) is prepared at one corner of the rigid printed circuitboard 200. Also, the fourth bonding pad (BP4) is prepared at one cornerof the flexible printed circuit cable 300, and the fifth bonding pad(BP5) is prepared at the other corner of the flexible printed circuitcable 300.

When the flexible printed circuit cable 300 is attached onto rigidportion 110 of the rigid-flex printed circuit board and the rigidprinted circuit board 200, one corner of the flexible printed circuitcable 300 is arranged to correspond to one corner of the rigid portion110, and the other corner of the flexible printed circuit cable 300 isarranged to correspond to one corner of the rigid printed circuit board200. In this case, the first bonding pad (BP1) is attached to the fourthbonding pad (BP4), and the third bonding pad (BP3) is attached to thefifth bonding pad (BP5). The method for attaching the bonding pads toeach other may be the hot-bar bonding method. If applying the hot-barbonding method, the circuit boards may be manufactured separately, andthen electrically connected with each other, instead of manufacturingthe circuit boards by one process,

According to an aspect of the present disclosure, the rigid-flex printedcircuit board, the rigid printed circuit board, and the flexible printedcircuit cable are respectively manufactured on the different motherboards, separately, and then combined with one another, whereby it ispossible to realize the more-improved spatial efficiency of the motherboard in comparison to a case of manufacturing the rigid-flex printedcircuit board, the rigid printed circuit board, and the flexible printedcircuit cable on one mother board.

According to an aspect of the present disclosure, the rigid-flex printedcircuit board, the rigid printed circuit board, and the flexible printedcircuit cable are respectively manufactured on the different motherboards so that it is possible to simplify the structure of the motherboard in accordance with the element to be provided on each motherboard.

According to an aspect of the present disclosure, the circuit boardmodule for a display device with the rigid-flex circuit board structure,the display device including the same, and the method for manufacturingthe same may be embodied by the hot-bar bonding method.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present disclosurewithout departing from the spirit or scope of the disclosures. Thus, itis intended that the present disclosure covers the modifications andvariations of this disclosure provided they come within the scope of theappended claims and their equivalents.

What is claimed is:
 1. A circuit board module for a display devicecomprising: a rigid-flex printed circuit board having a rigid portionand a plurality of flexible portions; a plurality of flexible printedcircuit cables attached to the rigid portion of the rigid-flex printedcircuit board; and a rigid printed circuit board electrically connectedto the rigid-flex circuit board through the plurality of flexibleprinted circuit cables.
 2. The circuit board module according to claim1, wherein the rigid-flex printed circuit board includes: a plurality offirst bonding pads in the rigid portion; and a plurality of secondbonding pads in the plurality of flexible portions.
 3. The circuit boardmodule according to claim 1, wherein the rigid printed circuit boardincludes a third bonding pad attached to the plurality of flexibleprinted circuit cables.
 4. The circuit board module according to claim3, wherein the plurality of flexible printed circuit cables include: afourth bonding pad attached to the first bonding pad; and a fifthbonding pad attached to the third bonding pad.
 5. The circuit boardmodule according to claim 2, wherein the rigid-flex printed circuitboard includes: a flexible base film having a first area overlapping therigid portion, and a plurality of second areas protruding from the firstarea and overlapping the plurality of flexible portions; a drivingwiring portion having a wiring portion on the flexible base film,wherein the wiring portion is connected with each of the plurality offirst bonding pads and the plurality of second bonding pads; and aprotection layer covering the driving wiring portion including thewiring portion, and portions of the first area and portions of thesecond area except for the plurality of first bonding pads and theplurality of second bonding pads.
 6. The circuit board module accordingto claim 2, further comprising a timing controller mounted on the rigidprinted circuit board.
 7. A display device comprising: a display panelhaving a panel pad portion and a chip mounting portion; a drivingintegrated circuit on the chip mounting portion; and a circuit boardmodule connected with the panel pad portion, wherein the circuit boardmodule comprises a rigid-flex printed circuit board having a rigidportion and a plurality of flexible portions; a plurality of flexibleprinted circuit cables attached to the rigid portion of the rigid-flexprinted circuit board; and a rigid printed circuit board electricallyconnected to the rigid-flex circuit board through the plurality offlexible printed circuit cables.
 8. The display device according toclaim 7, wherein the rigid-flex printed circuit board includes aplurality of first bonding pads in the rigid portion and a plurality ofsecond bonding pads in the plurality of flexible portions.
 9. Thedisplay device according to claim 7, wherein the rigid printed circuitboard includes a third bonding pad attached to the plurality of flexibleprinted circuit cables.
 10. The display device according to claim 9,wherein the plurality of flexible printed circuit cables include afourth bonding pad attached to the first bonding pad and a fifth bondingpad attached to the third bonding pad.
 11. The display device accordingto claim 8, wherein the rigid-flex printed circuit board comprises: aflexible base film having a first area overlapping the rigid portion,and a plurality of second areas protruding from the first area andoverlapping the plurality of flexible portions; a driving wiring portionhaving a wiring portion on the flexible base film, wherein the wiringportion is connected with each of the plurality of first bonding padsand the plurality of second bonding pads; and a protection layercovering the driving wiring portion including the wiring portion, andportions of the first area and portions of the second area except forthe plurality of first bonding pads and the plurality of second bondingpads.
 12. The display device according to claim 8, further comprising atiming controller mounted on the rigid printed circuit board.
 13. Amethod for manufacturing a circuit board module for a display devicecomprising: forming a rigid-flex printed circuit board having a rigidportion and a plurality of flexible portions on a first mother board;forming a rigid printed circuit board on a second mother board; forminga plurality of flexible printed circuit cables on a third mother board;and attaching the plurality of flexible printed circuit cables to therigid portion of the rigid-flex printed circuit board and the rigidprinted circuit board.
 14. The method according to claim 13, wherein thefirst mother board is a rigid mother board having a flexible base film,the second mother board is a rigid mother board, and the third motherboard is a flexible mother board.
 15. The method according to claim 13,wherein the rigid-flex printed circuit board includes a plurality offirst bonding pads in the rigid portion and a plurality of secondbonding pads in the plurality of flexible portions.
 16. The methodaccording to claim 13, wherein the rigid printed circuit board includesa third bonding pad attached to the plurality of flexible printedcircuit cables.
 17. The method according to claim 16, wherein theplurality of flexible printed circuit cables include a fourth bondingpad attached to the first bonding pad and a fifth bonding pad attachedto the third bonding pad.
 18. The method according to claim 17, whereinthe fourth and fifth bonding pads are respectively attached to the firstand third bonding pads through a hot-bar bonding method.
 19. The methodaccording to claim 15, wherein the rigid-flex printed circuit boardcomprises: a flexible base film having a first area overlapping therigid portion, and a plurality of second areas protruding from the firstarea and overlapping the plurality of flexible portions; a drivingwiring portion having a wiring portion on the flexible base film,wherein the wiring portion is connected with each of the plurality offirst bonding pads and the plurality of second bonding pads; and aprotection layer covering the driving wiring portion including thewiring portion, and portions of the first area and portions of thesecond area except for the plurality of first bonding pads and theplurality of second bonding pads.
 20. The method according to claim 13,further comprising a timing controller on the rigid printed circuitboard.